标 题: IBM ASIC design center recruitment
发信站: 南京大学小百合站 (Tue May 27 19:49:37 2008)

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================Who we are=================
We, the IBM Chip Design (China) team are the IBM local IC design center in Chi

na of IBM STG MD(Microelectronic Division), which provide IC design
services to the clients all over the world and support IBM internal chip and s

emiconductor development missions.
=============What we do=====================
We provided IC design services to the clients all over the
world and support IBM internal chip and semiconductor development
missions:
-- We help our clients to design PowerPC based SoC design.
-- We provided backend design services (Timing, PD, package, SI,
etc -- ASIC design services in IBMs glossary :) )
-- We provided frontend design services(logic design,
verification, FPGA demo, etc.)
-- We also do analog design, circuit design, foundry AE, etc.

=============Position=====================
Job description:
ASIC package(laminate) design, image(power bus) creating and verifying.
On die and package power system noise analysis, chip and system cominbational

SI/PI analysis.

Requirements:
Meet at least three items hereunder
1.Package/system design and SI experience.
2.Multiple layer(4+) PCB layout experience.
3.Familiar with phasicall design or SI/PI analysis process.
4.Familiar with Cadence layout/SI tool and Hspice.
5.Good ASIC physicall design background knowledge.
If you have interest , pls mail to:
yinwen372@163.com


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